Conductive bonding film + bonding with SUS
Conductive bonding film + SUS material allows external extraction of FPC's GND.
Conductive bonding films have adhesive layers that possess conductivity, which provides features such as wide-band shielding characteristics, stable electrical connections, and adhesion to various substrates. Therefore, when bonding a reinforcing plate to an FPC that involves component mounting, such as in camera modules, it is possible to impart shielding performance. Additionally, using metal reinforcing plates like SUS allows for electrical connection between the FPC's GND circuit and the metal reinforcing plate, thereby providing shielding performance. Meisei Electric has extensive experience in processing thermosetting conductive bonding films and SUS. The bonding of the bonding film and SUS can be done neatly using our in-house vacuum press machine, where we can control the temperature, vacuum time, pressure force, and duration. Furthermore, after bonding, circuit formation is possible through punching processing with the press machine. For tape processing products, we can propose optimal processes and methods tailored to your requirements, such as work size and product arrangement, which can lead to reduced processing time for customers and provide cost benefits. If you have any interest or inquiries, please feel free to contact us.
- Company：明星電気 本社(世田谷区用賀)、東北営業所(郡山市)、中部営業所(春日井市)、白河工場(西白河郡泉崎村)
- Price：Other
